Introducing the TMM3 PCB, a cutting-edge printed circuit board designed to deliver exceptional performance and reliability in a wide range of electronic applications. With its advanced ceramic, hydrocarbon, and thermoset polymer composites, the TMM3 PCB offers outstanding electrical properties, precise construction, and robust durability.
Material and Electrical Properties:
The TMM3 PCB utilizes a unique combination of ceramic, hydrocarbon, and thermoset polymer composites to provide superior performance. With a process dielectric constant (Dk) of 3.27 +/- .032 at 10 GHz/23°C and an extremely low dissipation factor of 0.002 at the same frequency and temperature, this PCB ensures efficient signal transmission and minimal signal loss. The thermal coefficient of Dk of 37 ppm/°C during -55°C to 125°C ensures stable performance across a wide temperature range. The TMM3 PCB is designed for reliable operation in temperatures ranging from -40℃ to +85℃.
| Property | TMM3 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.27±0.032 | Z | | 10 GHz | IPC-TM-650 2.5.5.5 |
| Dielectric Constant,εDesign | 3.45 | - | - | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor (process) | 0.002 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of dielectric constant | +37 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 |
| Volume Resistivity | 2 x 109 | - | Mohm.cm | - | ASTM D257 |
| Surface Resistivity | >9x 10^9 | - | Mohm | - | ASTM D257 |
| Electrical Strength(dielectric strength) | 441 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 |
| Thermal Properties |
| Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 |
| Coefficient of Thermal Expansion - x | 15 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Coefficient of Thermal Expansion - Y | 15 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Coefficient of Thermal Expansion - Z | 23 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Thermal Conductivity | 0.7 | Z | W/m/K | 80 ℃ | ASTM C518 |
| Mechanical Properties |
| Copper Peel Strength after Thermal Stress | 5.7 (1.0) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 |
| Flexural Strength (MD/CMD) | 16.53 | X,Y | kpsi | A | ASTM D790 |
| Flexural Modulus (MD/CMD) | 1.72 | X,Y | Mpsi | A | ASTM D790 |
| Physical Properties |
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.06 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.12 |
| Specific Gravity | 1.78 | - | - | A | ASTM D792 |
| Specific Heat Capacity | 0.87 | - | J/g/K | A | Calculated |
| Lead-Free Process Compatible | YES | - | - | - | - |
Features and Benefits:
The TMM3 PCB incorporates several features and benefits that make it an ideal choice for demanding electronic applications. Its coefficient of thermal expansion is carefully matched to copper, preventing issues related to thermal stress. With a thickness range of .0015 to .500 inches (+/- .0015”), this PCB offers flexibility in design and allows for precise customization. Its mechanical properties resist creep and cold flow, ensuring long-term durability. The TMM3 PCB is resistant to process chemicals, reducing the risk of damage during fabrication. The material's thermoset resin base allows for reliable wire-bonding, ensuring secure connections in various applications.
Stackup Configuration and Construction Details:
The TMM3 PCB features a 2-layer rigid stackup configuration, providing simplicity and efficiency for a variety of applications. The copper layers have a thickness of 35 μm, ensuring optimal conductivity and signal integrity. The Rogers Core TMM3, with a thickness of 1.524 mm (60mil), offers excellent structural stability and electrical performance.
With a board dimension of 155.1 mm x 168.12 mm, it provides ample space for component placement and ensures ease of integration. The PCB supports a minimum trace/space of 7/7 mils, allowing for intricate circuit designs. The minimum hole size of 0.45 mm enables precise drilling and component mounting. The absence of blind vias simplifies the manufacturing process, making it efficient and cost-effective. With a finished board thickness of 1.6 mm and a finished copper weight of 1 oz (1.4 mils) on the outer layers, the TMM3 PCB strikes the perfect balance between durability and performance.
To ensure optimal conductivity and protection against corrosion, the PCB features a 20 μm via plating thickness and a hot air soldering level (HASL) surface finish. The top silkscreen is in crisp white, enhancing component identification and readability. The top solder mask is green, providing visual appeal and functional protection.
Reliability and Quality Assurance:
The TMM3 PCB undergoes extensive testing and adheres to the IPC-Class-2 quality standard, ensuring high-quality and reliable performance. Each PCB undergoes a 100% electrical test prior to shipment, guaranteeing its functionality and adherence to specifications.
Applications and Global Availability:
The TMM3 PCB finds applications in various fields, including RF and microwave circuitry, power amplifiers and combiners, filters and couplers, satellite communication systems, global positioning systems antennas, patch antennas, dielectric polarizers and lenses, and chip testers. With worldwide availability, this PCB can be easily accessed and integrated into projects across the globe.
For any technical inquiries or questions, please contact Ivy at sales10@bichengpcb.com. Our team is dedicated to providing exceptional customer support and ensuring the successful implementation of the TMM3 PCB in your projects.
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60mil TMM3 1.6mm Double Sided RF PCB With Hot Air Soldering Level Images
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