This high-quality 2-layer PCB is constructed from RF-35, an advanced organic-ceramic laminate ideal for commercial microwave and radio frequency applications.
Layer Configuration
This PCB features a 2-layer stackup, consisting of:
- Copper Layer 1: 35 μm
- RF-35 Core: 20 mil (0.508 mm)
- Copper Layer 2: 35 μm
The dual-layer construction facilitates efficient signal transmission and minimizes crosstalk, crucial for maintaining signal integrity in high-frequency applications.
Dimensions and Specifications
- Board Dimensions: 239.5 mm x 130 mm (± 0.15 mm)
- Finished Thickness: 0.6 mm
- Minimum Trace/Space: 5/7 mils
- Minimum Hole Size: 0.3 mm
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers
- Surface Finish: Electroless Nickel Immersion Gold, providing excellent solderability and corrosion resistance.
Quality Control
Our PCBs undergo rigorous 100% electrical testing before shipment, ensuring that every unit meets the highest reliability standards. Manufactured to IPC-Class-2 specifications, these boards are designed for dependable performance in demanding environments.
| RF-35 Typical Values |
| Property | Test Method | Unit | Value | Unit | Value |
| Dielectric Constant @ 1.9 GHz | IPC-TM 650 2.5.5 | | 3.5 | | 3.5 |
| Dissipation Factor @ 1.9 GHz | IPC-TM 650 2.5.5 | | 0.0018 | | 0.0018 |
| Moisture Absorption (.060") | IPC-TM 650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Peel Strength (1/2 oz. copper) | IPC-TM 650 2.4.8 | lbs./linear inch | >8.0 | N/mm | >1.5 |
| Peel Strength (1 oz. copper) | IPC-TM 650 2.4.8 | lbs./linear inch | >10.0 | N/mm | >1.8 |
| Dielectric Breakdown | IPC-TM 650 2.5.6 | kV | 41 | kV | 41 |
| Volume Resistivity | IPC-TM 650 2.5.17.1 | Mohm/cm | 1.26 x 109 | Mohm/cm | 1.26 x 109 |
| Surface Resistivity | IPC-TM 650 2.5.17.1 | Mohm | 1.46 x 108 | Mohm | 1.46 x 108 |
| Arc Resistance | IPC TM 650 2.5.1 | seconds | >180 | seconds | >180 |
| Flexural Strength Lengthwise | ASTM D 790 | psi | >22,000 | N/mm2 | >152 |
| Flexural Strength Crosswise | ASTM D 790 | psi | >18,000 | N/mm2 | >124 |
| Thermal Conductivity | ASTM F 433 | W/m/K | 0.24 | W/m/K | 0.24 |
| Tensile Strength Lengthwise | ASTM D 638 | psi | 27,000 | N/mm2 | 187 |
| Tensile Strength Crosswise | ASTM D 638 | psi | 21,000 | N/mm2 | 145 |
| Dimensional Stability Lengthwise | IPC-TM 650 2.4.39 | in/in | 0.00004 | mm/mm | 0.00004 |
| Dimensional Stability Crosswise | IPC-TM 650 2.4.39 | in/in | -0.0001 | mm/mm | -0.0001 |
| x-y CTE | ASTM D 3386 (TMA) | ppm/°C | 19-24 | ppm/°C | 19-24 |
| z CTE | ASTM D 3386 (TMA) | ppm/°C | 64 | ppm/°C | 64 |
| Flammability | UL-94 | | V-0 | | V-0 |
| Hardness | Rockwell M Scale | | 34 | | 34 |
Performance Characteristics
Electrical Properties
The RF-35 PCB features a dielectric constant of 3.5 at 1.9 GHz, ensuring minimal signal loss for high-frequency applications. Its low dissipation factor of 0.0018 enhances operational efficiency, while moisture absorption is just 0.02%, maintaining stability in various environments. Additionally, a dielectric breakdown voltage of 41 kV provides robust electrical reliability.
Mechanical Properties
This PCB exhibits excellent mechanical strength, with peel strength ratings exceeding 8.0 lbs/in (1.5 N/mm) for 1/2 oz. copper and over 10.0 lbs/in (1.8 N/mm) for 1 oz. copper. Flexural strength measures greater than 22,000 psi (152 N/mm2) lengthwise and over 18,000 psi (124 N/mm2) crosswise. Tensile strength is also high, at 27,000 psi (187 N/mm2) lengthwise and 21,000 psi (145 N/mm2) crosswise, ensuring durability throughout manufacturing processes.
Thermal Properties
The PCB offers a thermal conductivity of 0.24 W/m/K, effectively dissipating heat. Its coefficient of thermal expansion (CTE) ranges from 19-24 ppm/°C in the X-Y direction and 64 ppm/°C in the Z direction, indicating stability under temperature changes. This thermal resilience is crucial for maintaining structural integrity in diverse operational conditions.
Benefits
Cost-Effectiveness
The RF-35 PCB offers a low-cost solution without compromising on quality or performance. Its design is optimized for high-volume production, making it an economical choice for manufacturers.
Enhanced Rework Capability
The excellent peel strength of RF-35 allows for easy rework of components. This is particularly beneficial in electronics manufacturing, where modifications and repairs are often necessary.
Low Moisture Absorption
With an ultra-low moisture absorption rate, RF-35 minimizes the risk of delamination and ensures long-term reliability, particularly in humid environments.
Smooth Surface Finish
The electroless nickel immersion gold finish provides a smooth surface, enhancing solderability and reducing the likelihood of defects during assembly.
Applications
The versatility of RF-35 PCB makes it suitable for a wide range of applications, including:
- Power Amplifiers: Essential for boosting signal strength in RF communication.
- Filters and Couplers: Used in various RF circuits to manage signal flow and reduce interference.
- Passive Components: Ideal for applications requiring low loss and high reliability.
Conclusion
This RF-35 PCB is a testament to advanced engineering and manufacturing processes. With its superior material properties, rigorous quality control, and versatile applications, it is an ideal solution for companies looking to enhance their electronic product offerings. By choosing our RF-35 PCB, you are investing in reliability, performance, and cost-effectiveness, ensuring that your products meet the demands of today’s high-frequency electronic landscape.
For more information or to place an order, please contact our sales team. We are here to assist you the best PCB solution for your needs.
Product Tags:
|
|
RF-35 PCB Double-Sided 20mil ENIG Finish Images
|
