The RO3010 PCB utilizes advanced ceramic-filled PTFE composites, offering a high dielectric constant combined with exceptional mechanical and electrical stability. This makes RO3010 an ideal choice for broadband components and a wide range of applications across various frequencies. The unique characteristics of these laminates facilitate circuit miniaturization, providing a competitive edge in performance and cost-effectiveness.
Key Features
Dielectric Constant: 10.2 ±0.30 at 10 GHz/23°C for superior signal integrity.
Dissipation Factor: Low at 0.0022 at 10 GHz/23°C, minimizing energy loss.
Coefficient of Thermal Expansion (CTE):
X: 13 ppm/°C
Y: 11 ppm/°C
Z: 16 ppm/°C
Thermal Degradation Temperature (Td): > 500°C for enhanced thermal stability.
Thermal Conductivity: 0.95 W/mK for effective heat management.
Moisture Absorption: Only 0.05%, ensuring reliability in various environments.
Operating Temperature Range: -40°C to +85°C.
Benefits
The RO3010 PCB offers numerous advantages:
Dimensional Stability: Expansion coefficients are closely matched to copper, reducing the risk of warping.
Cost-Effective Laminate: Economically priced for volume manufacturing, making it ideal for high-production runs.
Versatile Design Compatibility: Suitable for multi-layer board designs, enhancing design flexibility.
| RO3010 Typical Value |
| Property | RO3010 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 11.2 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0022 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -395 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.35
0.31 | X
Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | | MΩ.cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 105 | | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 1902
1934 | X
Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.05 | | % | D48/50 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.8 | | j/g/k | | Calculated |
| Thermal Conductivity | 0.95 | | W/M/K | 50℃ | ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) | 13
11
16 | X
Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | | ℃ TGA | | ASTM D 3850 |
| Density | 2.8 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 9.4 | | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
PCB Stackup Configuration
The RO3010 PCB features a 2-layer rigid stackup:
Copper Layer 1: 35 μm
RO3010 Substrate: 5 mil (0.127 mm)
Copper Layer 2: 35 μm
This configuration results in a finished board thickness of 0.2 mm, with a total copper weight of 1 oz (1.4 mils) on the outer layers.
Construction Details
Board Dimensions: 35 mm x 19 mm (1 piece)
Minimum Trace/Space: 6/5 mils
Minimum Hole Size: 0.3 mm
No Blind Vias included in the design.
Via Plating Thickness: 20 μm
Surface Finish: Immersion Gold for excellent solderability.
Silkscreen and Solder Mask: Features a white top silkscreen; no bottom silkscreen or solder mask applied.
Contour: Laser-cut profile for precise dimensions.
Quality Assurance: Each PCB undergoes a 100% electrical test prior to shipment to ensure reliability.
Quality Standards
This PCB meets the IPC-Class-2 quality standard, ensuring high reliability for various applications.
Typical Applications
The RO3010 PCB is suitable for a variety of applications, including:
Automotive Radar Applications
Global Positioning Satellite Antennas
Cellular Telecommunications Systems: Including power amplifiers and antennas.
Patch Antennas for Wireless Communications
Direct Broadcast Satellites
Datalink on Cable Systems
Remote Meter Readers
Power Backplanes
Availability
The RO3010 PCB is available for global procurement, making it an excellent choice for engineers and designers in need of high-performance solutions for RF and microwave applications.
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5mil Radio Frequency Circuit Board Rogers RO3010 PCB 2-Layer Immersion Gold Images
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