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50mil Rogers RO3010 PCB For Microwave And RF Applications

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50mil Rogers RO3010 PCB For Microwave And RF Applications

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Brand Name : Bicheng

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99/PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Material : RO3010

Layer count : 2-layer

PCB size : 85mm x 57 mm=1PCS

PCB thickness : 50 mil

Copper weight : 1oz (1.4 mils) outer layers

Surface finish : Immersion Gold

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In the rapidly evolving world of electronics, the demand for high-performance printed circuit boards (PCBs) continues to rise, particularly in applications requiring precision and reliability. The newly shipped Rogers RO3010 PCB stands out as a premier choice for engineers and manufacturers seeking exceptional performance in microwave and radio frequency (RF) applications.

Introduction to Rogers RO3010
The Rogers RO3010 is a sophisticated PCB material composed of ceramic-filled PTFE composites. This unique formulation not only offers a higher dielectric constant but also ensures excellent mechanical and electrical stability. These properties make the RO3010 an optimal choice for a wide range of applications, particularly in the field of broadband components. Its ability to simplify design complexities while supporting circuit miniaturization makes it a valuable asset for engineers looking to push the boundaries of technology.

Why Choose Rogers RO3010?
The RO3010 PCB is engineered for versatility, making it ideal for high-volume production environments. Its competitive pricing, combined with its robust performance characteristics, allows manufacturers to produce advanced electronic products without incurring prohibitive costs. With its exceptional stability across a broad frequency range, the RO3010 is perfectly suited for applications that demand reliability and precision.

Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.35
0.31
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105 COND A IPC 2.5.17.1
Tensile Modulus 1902
1934
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.05 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8 j/g/k Calculated
Thermal Conductivity 0.95 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
13
11
16
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃ TGA ASTM D 3850
Density 2.8 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 9.4 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes

Key Features of Rogers RO3010

Superior Dielectric Properties
The RO3010 PCB boasts a dielectric constant of 10.2 ± 0.30 at 10 GHz, providing superior signal integrity and minimizing signal loss. Additionally, its dissipation factor of 0.0022 at the same frequency ensures that energy efficiency is maintained, making it an excellent choice for high-frequency applications.

Thermal Stability and Conductivity
With a thermal decomposition temperature (Td) exceeding 500°C, the RO3010 can withstand extreme conditions without compromising performance. Its low coefficients of thermal expansion (CTE)—13 ppm/°C in the X direction, 11 ppm/°C in the Y direction, and 16 ppm/°C in the Z direction—ensure dimensional stability, which is essential in applications subject to thermal cycling. Furthermore, its thermal conductivity of 0.95 W/mK aids in effective heat dissipation, enhancing the longevity and reliability of the PCB.

Moisture Resistance
The RO3010 exhibits a moisture absorption rate of just 0.05%, ensuring that the board remains stable and reliable even in humid environments. This characteristic is particularly important for applications in outdoor settings or areas with fluctuating environmental conditions.

Benefits of Using Rogers RO3010

Dimensional Stability
The RO3010's matching expansion coefficient to copper contributes to its dimensional stability. This characteristic is crucial for maintaining the integrity of the PCB during temperature fluctuations, ensuring that the performance of the circuit remains consistent.

Cost-Effectiveness
Rogers RO3010 is competitively priced, making it an economical choice for volume manufacturing processes. This affordability allows manufacturers to produce high-quality PCBs without exceeding budget constraints, making it accessible for both large and small projects.

Flexibility for Multi-Layer Designs
The RO3010 is suitable for multi-layer board designs, giving engineers the flexibility to create complex circuit layouts that meet the demands of modern electronics. This capability is particularly beneficial in applications where space is limited, and miniaturization is a priority.

Technical Specifications

PCB Stackup: 2-layer rigid PCB

Copper Layer 1: 35 μm
Rogers RO3010 Substrate: 50 mil (1.27 mm)
Copper Layer 2: 35 μm

Board Dimensions: 85 mm x 57 mm, +/- 0.15 mm
Minimum Trace/Space: 4/4 mils
Minimum Hole Size: 0.3 mm
Finished Board Thickness: 1.4 mm
Finished Copper Weight: 1 oz (1.4 mils) on outer layers
Via Plating Thickness: 20 μm
Surface Finish: Immersion gold
Silkscreen: None on both sides
Solder Mask: None on both sides
Counter-Sunk Holes: For M6 screws
Quality Assurance: 100% electrical testing prior to shipment

50mil Rogers RO3010 PCB For Microwave And RF Applications

Applications of Rogers RO3010 PCB

The versatility of the Rogers RO3010 PCB makes it suitable for a wide range of high-performance applications, including:

Automotive Radar Applications: Essential for advanced driver-assistance systems (ADAS) where reliable signal processing is critical.

GPS Antennas: Supporting precise positioning and navigation capabilities in various devices.

Cellular Telecommunications Systems: Ideal for power amplifiers and antennas, facilitating robust communication in mobile devices.

Patch Antennas: Perfect for wireless communications, providing compact designs with high efficiency.

Direct Broadcast Satellites: Supporting high-frequency operations for efficient satellite communication.

Data Link on Cable Systems: Enhancing connectivity and data transmission reliability in cable networks.

Remote Meter Readers: Enabling efficient wireless data collection and monitoring.

Power Backplanes: Supporting high-density, multi-layer configurations for power distribution in complex systems.

Conclusion
The Rogers RO3010 PCB is a significant advancement in the realm of printed circuit materials, offering a blend of high performance, cost-effectiveness, and versatility that meets the demands of modern electronics. Its superior dielectric properties, thermal stability, and moisture resistance make it an ideal choice for engineers and manufacturers across multiple industries.

For more information or to explore how the Rogers RO3010 can enhance your projects, please contact our sales team or visit our website. Embrace the future of circuit design with the Rogers RO3010 PCB—your partner in innovation and reliability.

50mil Rogers RO3010 PCB For Microwave And RF Applications


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